Staff Packaging Engineer

**Staff Packaging Engineer**:

- Experience Level: Individual Contributor- Job Type: Full-Time- Location: Costa Rica - Heredia, CR- Requisition ID: 4735Staff Packaging Engineer (Integration)

Qorvo, Inc. (Nasdaq: QRVO) is a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies. Qorvo is recognized for its diverse portfolio of semiconductor technologies and RF systems. Our products are utilized in a diverse RF market that include the world’s leading suppliers of mobile phones, cellular infrastructure, commercial radios, Aerospace and Defense, and other communications equipment.

Qorvo is looking for Staff Packaging Engineer with knowledge of semiconductor materials, acoustic filters, and flip chip assembly with a desire to join Qorvo’s Global Package Engineering Team working at our Assembly facility in San Juan, Costa Rica.

**Responsibilities**:

- Leverage Qorvo developed cutting edge DPS (die processing services) technologies to enable new product introduction.
- Work in collaboration with Wafer and Filter R&D and business unit groups to innovate and develop next generation packaging solutions incorporating Si and GaAs semiconductor devices and SAW and BAW based filter solutions.
- Facilitate or lead cross-functional technical teams through New Product Introduction (NPI), risk assessments, and/or problem solving.
- Drive the selection, development, and ramp of new DPS technologies and roadmap-driven packaging technologies.
- Ensure Best Known Methods are shared between internal factories and keep pace with industry.
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.

**Requirements**:

- Minimum B.S in Physics, Material Science, Chemical or Mechanical Engineering.
- Ability to excel in a dynamic collaborative team environment including working directly with design, wafer fab, materials, prototype, and OSAT teams as well as external customers.
- Knowledge of semiconductor and acoustic materials including Si, LiTaO3, LiNbO3, GaAs, and others.
- Expertise in one or multiple DPS processes including mechanical dicing, stealth dicing, plasma dicing, laser grooving, dice before backgrind, die to tape, and advanced automated inspection techniques preferred.
- Experience with advanced SMT flip chip assembly beneficial.
- Strong problem solving skills and experience with various methodologies and tools.
- Capable in data analysis and ability to communicate results to both internal and external customers.
- 5+ years experience with minimum of 2 years in an integration role.

MAKE A DIFFERENCE AT QORVO We are Qorvo. We do more than create innovative RF solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
- We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, national origin, age, disability, status as a protected veteran, or other legally protected status._

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.